Suited for 32 and 22 nm technologies, ORION® Single Wafer Cleaning System features closed chamber design for complete control and containment of wafer environment. It addresses issues such as reduction of material loss during photoresist stripping after ultra shallow implants and elimination of material loss and galvanic corrosion in high-k metal gates and copper interconnects with metal containing capping layers. 3D cluster configuration optimizes throughput and flexibility.
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Thursday, April 9, 2009
Wafer Cleaning System uses recipe-driven procedures
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